Lind5
- Karma
- 1,394
- Created
- 10 years ago
Recent Submissions
- 1. ▲ Crisis Ahead: Power Consumption in AI Data Centers: Four Areas Chips Can Help (semiengineering.com)
- 2. ▲ AI Pushes High-End Mobile from SoCs to Multi-Die (semiengineering.com)
- 3. ▲ Chip Architectures Becoming Much More Complex with Chiplets (semiengineering.com)
- 4. ▲ HBM’s Future: Necessary but Expensive (semiengineering.com)
- 5. ▲ Entangled Photons Tailor-Made (mpq.mpg.de)