The partnership between Intel and Submer, initially announced in early 2022, has finally borne fruit. This week, the two companies unveiled the Forced Convection Heat Sink (FCHS) package designed to cool down chips with thermal design power of 1000W and above. The device promises to be a reliable and cost-effective solution for future datacenter processors with extremely high heat dissipation.
"Many have challenged the technological runway of single-phase immersion cooling," said Daniel Pope, Co-Founder and CEO of Submer. "The Forced Convection Heat Sink is the undeniable proof that immersion is here to compete head-on with other liquid cooling technologies, including Direct Liquid Cooled water-based cold plates."
"An immersion heat sink utilizing forced convection is a key innovation in taking single-phase immersion cooling beyond the current barriers, allowing single-phase immersion not only to be a solution of today but also a solution of the future," said Mohan J Kumar, Intel Fellow.