Qualcomm Inc. has agreed to license patents underpinning Huawei Technologies Co.’s novel LogicFolding chipmaking technique, a win for the Chinese company and its push to advance in overseas AI markets.
The multiyear deal is part of a cross-license agreement between the two chipmakers, spanning technologies related to 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson said Monday.