China claims 3D hybrid bonding techniques for 120 TFLOPS of power

Original title is "China claims domestically-designed 14nm logic chips can rival 4nm Nvidia silicon — architecture leverages 3D hybrid bonding techniques for claimed 120 TFLOPS of power".

And the key conclusion is "14nm logic bonded directly to 18nm DRAM to drastically increase memory bandwidth and reduce compute latency."

I cannot tell it is real or not.